Location and Contact

The Trion Phantom etcher is located in the plasma etch bay of the WCAM cleanroom. This is a class 10 cleanroom. Please contact WCAM for access. http://www.engr.wisc.edu/centers/wcam/

Process Description

The Trion Phantom etcher has an Inductively Coupled Plasma (ICP) source. The ICP allows the user to create high-density plasma. High-density plasma results in increased etch rates and anisotropy. An electrostatic chuck provides increased sample cooling during the etching process. Cooling temperatures as low as -40ºC can be achieved.

Equipment Description

The system is controlled via a PC interface with touch screen controls. The Phantom has both 1000 Watt ICP and 600 Watt RIE power supplies. The etcher can accommodate a wide variety of substrate sizes.

Etch Gases Available

• Oxygen
• CF4
• CHF3
• N2
• SF6